An evolution of the highly successful NC258 platform, M8 brings no clean solder paste performance to the next level. Developed in combination with T4 and finer mesh leaded alloy powders, M8 provides stable transfer efficiencies required for today’s UFP and umBGA devices, reducing DPMO on the most challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 activators will reduce wetting related defects such as HiP (head-in-pillow) and provide smooth shiny joints. M8 has reduced BGA and BTC voiding to as low as <5% on BGA and <10% on BTC ground pads.