Flip-up stencils are small solder paste stencils typically used to print a single component a printed circuit board.
They were designed to be used with the MSP 100/300/400 and SH-1 printers though they can be used manually.
They come with a holder and a squeegee blade. A flip-up stencil is a great tool for PCB rework and printed circuit board assembly.
Flip-up Stencils are custom made for any component and can be customized with relief areas, to eliminate removing neighboring components.
They have the same footprint and aperture sizes used in a regular production stencil.
They can be made in BGA, QFP, PLCC, SOIC, and connector patterns.
Key features:
Smooth Aperture Walls
Excellent Print Performance
Reduce rework assembly time
Improve quality of rework
Gerber data or mechanical drawings
Optimum stability
Do not contaminate surrounding areas
Front ramps to prevent solder paste spillage
Reinforced walls to prevent side to side shift
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