The UltraSlic™ high performance stencil technology has become the preferred choice when printing assemblies with challenging miniature components. The addition of a permanent, hydrophobic nano-coating to the UltraSlic™ stencil foil minimizes the ability of solder paste to stick to the stencil apertures and the bottom side of the foil. With the new nano-coating, up to a 10X increase in the number of prints before cleaning the stencil is possible, as well as successful printing at surface area ratios below 0.45.
The UltraSlic™ Stencil is the first laser-cut, solder paste stencil that has paste release performance comparable to electroform technology, yet can be cut and shipped the same day the order is placed. UltraSlic™ Stencils incorporate the latest advancements in stencil laser technology along with a new, cutting-edge Fine Grain stencil material from Datum Alloys.
UltraSlic™ Stencils have lower standard deviations, higher repeatability and cleaner release of solder paste compared to other stencil technologies. A more consistent solder paste deposition, as well as a reduction in stencil cleaning frequency and rework results in higher yields and tremendous throughput improvements.
For solder paste you will see improved print quality and release and especially with paste types 6, 7 and 8 where PSD can be as low as 1 or 2 microns.
Super smooth surface technology, coupled with our unique wetcoat treatment results in a stencil substrate that will out-print any material on the market.
are laser cut solder paste stencil foils
permanently mounted in a stencil frame using a mesh border to tightly stretch the stencil foil taut in the frame.