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Rework Stencils
StencilQuik are flexible solder paste stencils that remain in place on the site location becoming an integral part of the prototype printed circuit board assembly. They allow you to simplify area array device placement/replacement saving 50% or more of the time required to rework BGAs or CSPs.CSPs.
StencilMate Leadless Device Rework Stencils
StencilMate Leadless Device Rework Stencils
LEAD TIME : 5 business days
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Price : $70.00

Were designed to reliably and quickly replace leadless device packages such as QFNs or LGA packages.

  • Alignment is simple. No need to use custom fixtures or frames.
  • The stencil is cut using a laser to your exacting device requirements.
  • Elimnate the need to use capital intensive equipment or require a high degree of skill.
StencilQuik BGA Rework Stencils
StencilQuik BGA Rework Stencils
LEAD TIME : 5 business days
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Price : $74.00

StencilQuik™ are flexible solder paste stencils manufactured from a polyimide film with a high temperature adhesive covered with a release liner. They serve as both your stencil and alignment device.

  • StencilQuik comes in a pack of 10 BGA rework stencils.
  • Allows you to replace your own BGAs or CSPs without special training or large capital equipment expenditures
  • Acts as an insulating barrier between solder balls as the solder paste masks adjacent apertures increasing placement reliability
  • Simplifies BGA placement as you can "feel" the device settle into the apertures of the StencilQuik™
Quick-Turn Rework Stencils
Quick-Turn Rework Stencils
LEAD TIME : 24-Hour Turn
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Price : $80.00
These laser cut stencils are typically used to manually print a single component on a printed circuit board.
  • Maximum Size 2" x 2"
  • Available with or without flaps (Flaps facilitate handling)
  • Mainly used for PCB rework but can used for prototype PCB assembly of simple boards
StikNPeel™ Rework Stencils
StikNPeel™ Rework Stencils
LEAD TIME : Ships with 24-48 hours
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Price : $80.00

StikNPeel™ greatly simplifies the ability to selectively print solder paste onto various areas of a PCB. Simply peel off the backing, place the StikNPeel™ onto the PCB and apply the paste.

  • This rework process overcomes many of the headaches of using metal stencils
  • Eliminates "smearing" of solder paste underneath the stencil
  • Co planarity between board and stencil is assured due to the adhesive backing on the stencil
Flip-Up Stencils
Flip-Up Stencils
LEAD TIME : 3-5 Days
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Price : $89.00
Flip-Up Stencils are single site stencils, used to apply solder paste onto circuit board pads of BGAs, QFNs, QFPs, TSOPS, PLCCs, etc.
  • Great for QFNs where the pads on the board are larger than the pads on the component.
  • All Flip Up stencils are made from stainless steel and are reusable after a quick wash in an alcohol based cleaner.
  • All Flip Up stencils are custom made to order per your specification.
CPF Stencils
CPF Stencils
LEAD TIME : 3-5 Days
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Price : $135.00
CPF Stencils (or Component Print Frame) are used to apply solder paste directly onto BGA and Leadless components.
  • A CPF stencil makes for simple alignment when pasting, and serves as an excellent tool for applying paste when boards are highly populated.
  • All CPF stencils are made from stainless steel and are reusable after a quick wash in an alcohol based cleaner.
  • All CPF stencils are custom made to order per your specification.
BGA Rework StencilQuik Kit
BGA Rework StencilQuik Kit
LEAD TIME : 5 business days
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Price : $200.00
The StencilQuik BGA Rework Kit includes all of the materials you need to place most BGAs that you will encounter. These rework tools packaged together along with your specified solder paste or tacky flux supplies you with the tools you need to place BGAs and other area array devices quickly and reliably.

This kit equips you with the necessary StencilQuik stencils to place 0.5mm, 0.8mm, 1.0mm, 1.27mm, and 1.5mm pitch area array devices. Full array StencilQuik patterns can be customized by either trimming the stencil for smaller package sizes or by masking off the center areas to create a perimeter array. These flexible solder paste stencils remain in place on the site location becoming an integral part of the printed circuit board assembly