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••• WS488 T4 WATER SOLUBLE LEAD FREE SOLDER PASTE

WS488 T4 WATER SOLUBLE LEAD FREE SOLDER PASTE

LEAD TIME: In Stock    |     PRICE : $25.00
Packaging: *

QUICK OVERVIEW
AIM’s WS488 water soluble paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 is compatible with all leaded and lead-free alloys, and has been developed for use in a wide range of applications.
  • Alloy Sn63/Pb37 MP=183°C
  • Large Process Window
  • Excellent Wetting
  • Stencil Life > 8 Hours
  • T4 in stock and ready to ship

MAIN FEATURES

  • Excellent Wetting
  • Extended Cleaning Window
  • Superior Slump Resistance
  • 8 Hour+ Stencil Life
  • Wash With Water Alone
  • Low Foaming

PRODUCT DESCRIPTION

AIM’s WS488 water soluble solder paste has been engineered for powerful wetting performance on all solderable electronic surfaces, components, assemblies, and substrates. WS488 offers robust environmental tolerance, excellent print characteristics and 8+ hours of stencil life. WS488 has been developed to provide stable performance with all leaded and lead-free alloys. WS488 highly soluble residues are easily removed in plain water, even under low stand-off components. This all-purpose water soluble product was created to meet the industry’s demand for a consistently reliable water soluble solder paste.

PRINTING

Recommended Initial Printer Settings - Dependent on PCB and Pad Design
Parameter Recommended Initial Settings
Squeegee Pressure 0.10-0.30 kg/cm (.6 - 1.7 lbs/In.) of blade
Squeegee Speed 12-150 mm/sec (.5-6”/sec)
Snap-off Distance On Contact 0.00 mm
PCB Separation Distance 0.75 - 2.0 mm
PCB Separation Speed Slow

CLEANING

Pre-Reflow: AIM DJAW-10 effectively removes WS488 solder paste from stencils while in process. DJAW-10 can be hand applied or used in under stencil wipe equipment. DJAW10 will not dry WS488 and will enhance transfer properties. Do not over-apply DJAW-10. Do not apply DJAW-10 to stencil topside. Isopropanol (IPA) is not recommended in process, but may be used as a final stencil rinse. Post-Reflow Flux Residue: WS488 residues can remain on the assembly after reflow for up to 2 weeks without corrosion. Cleaning is mandated and can be performed in plain water following with a final rinse in DI water.

REFLOW PROFILE

Please refer to datasheets.

HANDLING AND STORAGE

Parameter Time Temperature
Refrigerated Shelf Life 6 Months 0°C-12°C (32°F-55°F)

Do not add used paste to unused paste. Store used paste separately; keep unused paste tightly sealed with internal plug or end cap in place. See AIM’s paste handling guidelines for further information.

PHYSICAL PROPERTIES

SPECIFICATION
Alloy SAC305
Appearance Gray, Smooth, Creamy
Melting Point 217° C
Particle Size T3, T4, T5
Metal Loading 88.5% (T3)
Viscosity Print/Dispense
Packaging Available in all industry standard packaging.