- Excellent Wetting
- Extended Cleaning Window
- Superior Slump Resistance
- 8 Hour+ Stencil Life
- Wash With Water Alone
- Low Foaming
AIM’s WS488 water soluble solder paste has been engineered for powerful wetting performance on all solderable electronic
surfaces, components, assemblies, and substrates. WS488 offers robust environmental tolerance, excellent print
characteristics and 8+ hours of stencil life. WS488 has been developed to provide stable performance with all leaded and
lead-free alloys. WS488 highly soluble residues are easily removed in plain water, even under low stand-off components.
This all-purpose water soluble product was created to meet the industry’s demand for a consistently reliable water
soluble solder paste.
|Recommended Initial Printer Settings - Dependent on PCB and Pad Design
||Recommended Initial Settings
||0.10-0.30 kg/cm (.6 - 1.7 lbs/In.) of blade
||12-150 mm/sec (.5-6”/sec)
||On Contact 0.00 mm
|PCB Separation Distance
||0.75 - 2.0 mm
|PCB Separation Speed
Pre-Reflow: AIM DJAW-10 effectively removes WS488 solder paste from stencils while in process. DJAW-10 can be hand
applied or used in under stencil wipe equipment. DJAW10 will not dry WS488 and will enhance transfer properties. Do not
over-apply DJAW-10. Do not apply DJAW-10 to stencil topside. Isopropanol (IPA) is not recommended in process, but may be
used as a final stencil rinse.
Post-Reflow Flux Residue: WS488 residues can remain on the assembly after reflow for up to 2 weeks without corrosion.
Cleaning is mandated and can be performed in plain water following with a final rinse in DI water.
Please refer to datasheets.
HANDLING AND STORAGE
|Refrigerated Shelf Life
Do not add used paste to unused paste. Store used paste separately; keep unused paste tightly sealed with internal plug
or end cap in place. See AIM’s paste handling guidelines for further information.
||Gray, Smooth, Creamy
||T3, T4, T5
||Available in all industry standard packaging.