An evolution of the highly successful NC258 platform, M8 brings no clean solder paste performance to the next level. Developed in combination with T4 and finer mesh leaded alloy powders, M8 provides stable transfer efficiencies required for today�s UFP and umBGA devices, reducing DPMO on the most challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 activators will reduce wetting related defects such as HiP (head-in-pillow) and provide smooth shiny joints. M8 has reduced BGA and BTC voiding to as low as <5% on BGA and <10% on BTC ground pads.
An evolution of the highly successful NC258 platform, M8 brings no clean solder paste performance to the next level. Developed in combination with T4 and finer mesh leaded alloy powders, M8 provides stable transfer efficiencies required for today�s UFP and umBGA devices, reducing DPMO on the most challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 activators will reduce wetting related defects such as HiP (head-in-pillow) and provide smooth shiny joints. M8 has reduced BGA and BTC voiding to as low as <5% on BGA and <10% on BTC ground pads.
LEAD TIME :
Syringe and Jar In Stock
|
Price :
$20.00
AIM�s WS488 water soluble paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 is compatible with all leaded and lead-free alloys, and has been developed for use in a wide range of applications.
AIM’s WS488 water soluble paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 is compatible with all leaded and lead-free alloys, and has been developed for use in a wide range of applications.
The NC676, manufactured by FCT Solder, is a new generation halide-free, rosin-based chemistry designed to provide a previously unseen level of
repeatability and consistency to the printing process. Ideal for leaded printed circuit board assembly.
The WS159, manufactured by FCT Solder, is designed to provide humidity tolerance and excellent wetting to meet the requirements
for reliable solder joints in printed circuit board assemblies.
The NL932, manufactured by FCT Solder, delivers Surface Area Ratio (SAR) paste transfer efficiencies below 0.6 and 0.55 respectively. NL932 is formulated to deliver
exceptional cosmetics, especially when used in conjunction with Nihon Superior�s SN100C patented lead free alloy. It was specially designed to meet the requirements for reliable solder joints in printed circuit board assemblies.
The WS888, manufactured by FCT Solder, displays previously unseen levels of repeatability and consistency even in a wide range of temperatures (65�-85�F) and relative
humidity (25% - 65% RH). Commonly used in printed circuit board assembly.
