Solder paste is available for immediate delivery in 250 gram jars and 30 gram syringes:
To help us meet your specific needs, please provide us with information on your alloy, flux type, powder size and packaging preferences.
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NC-560-LF is a lead-free, no-clean, halide-free solder paste that delivers improved solderability with all Pb-Free metallization, including ENIG (Gold), OSP, HASL and immersion silver printed circuit boards. This solder paste is also low beading, low voiding, and anti-tombstoning to reduce scrap and rework.
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The 4300 series offers true multi-process capabilities, ideal for water washable applications, able to be cleaned using standard aqueous cleaning systems without saponification. Utilizes synthetic materials that deliver ideal printing characteristics, unparalleled lot-to-lot consistency and extremely long stencil life. LF-4300 is also VOC and halide-free, and classified as RELO.
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