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••• NC165 NO CLEAN FLUX
NC165 No Clean Flux
Temporarily Out of Stock
PRICE : $110.00
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NC165 NO CLEAN FLUX is a halide-free, no clean activated material formulated to work with Printed Circuit Board Assembly’s SN100C Bar Solder and standard Sn/Pb Alloys. NC165 eliminates solder balls while providing excellent solderability with minimal flux residue.
A solder temperature of 250-260 degrees C should be maintained
Available in 1 Gallon Container
NC165 has slightly lower solids content than NC160 for applications where less flux residue is desired.
Material Safety Data Sheets (MSDS)
NC1165 No Clean Flux MSDS
The specific gravity of the flux should be maintained between 0.80 and 0.84.
The amount of flux to be applied during foaming applications should be between 800 and 1300 micrograms per square inch of solids.
The amount of flux to be applied during spray application should be between 475 and 850 micrograms per square inch of solids.
Specific Gravity at 20 Degrees C: 0.80 – 0.84
Acid Number (mgKOH/gm): 22 - 26
Color: Clear to light amber
Copper Mirror: Low Activity
J-STD-004 Classification: ORL0
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