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••• NC160 LEAD FREE FLUX
NC160 Lead Free Flux
LEAD TIME: 4 Days |
PRICE : $25.00
Data Sheet
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QUICK OVERVIEW
NC160 NO CLEAN FLUX is a halide-free, no clean activated material for printed circuit board surface mounting. NC160 is formulated to work with Printed Circuit Board Assembly’s SN100C Bar Solder.
A solder temperature of 250-260 degrees C should be maintained
Excellent Solderability
Available 1 Gallon Container
OVERVIEW
SPECS
Product Description
NC160 eliminates solder balls while providing excellent solderability with minimal flux residue so that cleaning is not necessary.
Material Safety Data Sheets (MSDS)
NC160 Lead Free Flux MSDS
Information:
Specific Gracvity should be maintained between .81 and .84
Amount of flux applied during foaming applications should be between 800 and 1300 micrograms per square inch of circuit.
Amount of flux to be applied during spray should be between 475 and 850 micrograms per square inch of circuit
Solids Content: 5.5-6.0% wt
Specific Gravity at 20 Degrees C: .81-.84
Acid Number (mgKOH/gm): 22-27
Color: Clear to light amber
Copper Mirror: Low Activity
J-STD-004 Classification: ROL0
Halides Content:0.00%