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NC160 Lead Free Flux

LEAD TIME: 4 Days    |     PRICE : $25.00
Data Sheet PDF

NC160 NO CLEAN FLUX is a halide-free, no clean activated material for printed circuit board surface mounting. NC160 is formulated to work with Printed Circuit Board Assembly’s SN100C Bar Solder.

  • A solder temperature of 250-260 degrees C should be maintained
  • Excellent Solderability
  • Available 1 Gallon Container

Product Description
NC160 eliminates solder balls while providing excellent solderability with minimal flux residue so that cleaning is not necessary.

Material Safety Data Sheets (MSDS)
NC160 Lead Free Flux MSDS

  • Specific Gracvity should be maintained between .81 and .84
  • Amount of flux applied during foaming applications should be between 800 and 1300 micrograms per square inch of circuit.
  • Amount of flux to be applied during spray should be between 475 and 850 micrograms per square inch of circuit