- Low Voiding: <5% on BGA and <10% on BTC Components
- Excellent Print Transfer Efficiencies on 01005 Components
- Eliminates HiP Defects
- REACH and RoHS* Compliant
- Formulated for use with T4 and Finer Powders
- Approved for use with MPM Enclosed Flow
- Print Speeds up to 200mm/sec
- Passes Bono Testing
An evolution of the highly successful NC258 platform, M8 brings no clean solder paste
performance to the next level. Developed in combination with T4 and finer mesh leaded
alloy powders, M8 provides stable transfer efficiencies required for
today�s UFP and umBGA devices, reducing DPMO on the most challenging applications.
A novel activator system provides powerful, durable wetting action accommodating a
wide range of profiling processes and techniques. M8 activators will reduce wetting
related defects such as HiP (head-in-pillow) and provide smooth shiny joints. M8 has
reduced BGA and BTC voiding to as low as <5% on BGA and <10% on BTC ground pads.
HANDLING & STORAGE
|Refrigerated Shelf Life
| Unrefrigerated Shelf Life
||< 25�C (< 77�F)
Do not add used paste to unused paste. Store used paste separately; keep unused paste
tightly sealed with internal plug or end cap in place. See AIM�s paste handling
guidelines for further information.
Pre-Reflow: AIM DJAW-10 effectively removes M8 solder paste from stencils while in process.
DJAW-10 can be hand applied or used in under stencil wipe equipment. DJAW-10 will not
dry M8 and will enhance transfer properties. Do not over-apply DJAW-10. Do not apply
DJAW-10 to stencil topside. Isopropanol (IPA) is not recommended in process, but may be
used as a final stencil rinse.
Post-Reflow Flux Residue: M8 residues can remain on the assembly after reflow and do not
require cleaning. Where cleaning is mandated, AIM has worked closely with industry
partners to ensure that M8 residues can be effectively removed with common defluxing
agents. Contact AIM for cleaning compatibility information.
|Recommended Initial Printer Settings - Dependent on PCB and Pad Design
||Recommended Initial Settings
||0.4 - 0.7kg/25mm
||13 � 152 mm/second
||On Contact 0.00 mm
|PCB Separation Distance
||0.75 - 2.0 mm
|PCB Separation Speed
||3 - 20 mm/second