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••• KESTER WIRE SOLDER, SN96.5/AG3.0/CU0.5, # 331 WATER-SOLUBLE FLUX, 1-LB. ROLL

Kester Wire Solder, Sn96.5/Ag3.0/Cu0.5, # 331 Water-Soluble Flux, 1-lb. Roll

Kester Wire Solder, Sn96.5/Ag3.0/Cu0.5, # 331 Water-Soluble Flux, 1-lb. Roll
LEAD TIME: In stock and ready for shipment    |     PRICE : $65.00
Data Sheet PDF

QUICK OVERVIEW

This is a lead-free, water soluble cored wire solder. It has a SAC305 lead-free alloy, #331 water soluble flux, and #66 flux core size. Kester's SAC305 lead-free wire solder is comprised of 96.5% Tin, 3.0% Silver, and 0.5% Copper (Sn96.5/Ag3.0/Cu0.5) with a melting temperature range of 422°F to 428°F. Kester lead-free wire solders have been tested and proved to give good contact angles and shiny joints. Kester Formula #331 is a high-activity, water soluble core flux for soldering difficult metals. It exhibits the same fast action and mild properties as Kester's popular 2331-ZX neutral organic water soluble liquid flux. The flux is more heat stable than most organic fluxes, resulting in minimal smoke and odor. Its residue can be completely removed with a simple water rinse. Kester #331 is classified as ORH1 per J-STD-004.

  • SAC305 (Sn96.5/Ag3.0/Cu0.5) Lead-Free Alloy
  • .015" and 0.31" Wire Diameters
  • #331 Water Soluble Flux
  • #66 Flux Core Size

ORDER FORM OVERVIEW SPECS
Wire Diameter: *
Kester 331 Organic Flux is a water soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more effective than rosin fluxes in soldering difficult metals. The same fast action and mild properties are exhibited with 331 Organic Flux as with the liquid 2331-ZX. The flux is more heat stable than most organic fluxes, resulting in minimal smoke and odor. The residue can be completely removed with a simple water rinse. It is used in electronics assembly (printed circuit board assembly).

Material Safety Data Sheets (MSDS)
Kester 331 Lead Freee Water Washable Wire Solder Sn96.5/Ag3.0/Cu0.5 MSDS

Performance Characteristics:
  • Excellent solderability to a wide variety of metallizations
  • Easy residue removal in DI water
  • Compatible with leaded and lead-free alloys
  • Classified as ORH1 per J-STD-004