••• SOLDER PASTE

Solder paste is available for immediate delivery in 250 gram jars and 30 gram syringes:

  • Leaded No Clean & Water Soluble Solder Paste
  • Lead Free No Clean & Water Soluble Paste

To help us meet your specific needs, please provide us with information on your alloy, flux type, powder size and packaging preferences.

AIM Solder

› NC520/NC254 NO CLEAN SOLDER PASTE (LEADED OR LEAD FREE)

LEAD TIME : Syringe and Jar In Stock | Price : $20.00
AIMs NC520 and NC254 are designed for the most demanding high density electronic assemblies. They have been developed to offer excellent wetting, improved printing and to reduce voiding during the circuit board assembly process.
  • Alloy Sn63/Pb37 MP=183C
  • High Density Assemblies
  • Excellent Wetting
  • Alloy SAC305 MP=217C (Lead Free)
  • Stencil Life > 8 Hours
  • T4 in stock and ready to ship

› WS488 WATER SOLUBLE SOLDER PASTE (LEADED OR LEAD FREE)

LEAD TIME : Syringe and Jar In Stock | Price : $20.00
AIMs WS488 water soluble paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 is compatible with all leaded and lead-free alloys, and has been developed for use in a wide range of applications.
  • Alloy Sn63/Pb37 MP=183C
  • Large Process Window
  • Excellent Wetting
  • Alloy SAC305 MP=217C (Lead Free)
  • Stencil Life > 8 Hours
  • T4 in stock and ready to ship

FCT Solder

› NC676 NO CLEAN SOLDER PASTE

LEAD TIME : Syringe/Jar 5 days | Price : $20.00
The NC676, manufactured by FCT Solder, is a new generation halide-free, rosin-based chemistry designed to provide a previously unseen level of repeatability and consistency to the printing process. Ideal for leaded printed circuit board assembly.
  • Alloy Sn63/Pb37 MP=183C
  • Stencil life > 8 hours
  • Extensive Tack Time
  • Halogen and Halide Free
  • Speed 25 to 150 mm/sec.
  • Clear Residue

› WS159 WATER SOLUBLE SOLDER PASTE

LEAD TIME : Syringe/Jar 5 days | Price : $20.00
The WS159, manufactured by FCT Solder, is designed to provide humidity tolerance and excellent wetting to meet the requirements for reliable solder joints in printed circuit board assemblies.
  • Alloy Sn63/Pb37
  • Stencil life > 6 hours
  • Good Activity
  • Cleans Easily
  • Speed: 25 to 150 mm/sec.
  • Shiny Solder Joints

› NL932 NO CLEAN LEAD FREE SOLDER PASTE

LEAD TIME : Syringe/Jar 5 days | Price : $30.00
The NL932, manufactured by FCT Solder, delivers Surface Area Ratio (SAR) paste transfer efficiencies below 0.6 and 0.55 respectively. NL932 is formulated to deliver exceptional cosmetics, especially when used in conjunction with Nihon Superiors SN100C patented lead free alloy. It was specially designed to meet the requirements for reliable solder joints in printed circuit board assemblies.
  • Alloys SAC305 & SN100C
  • Stencil life > 8 hours
  • Extensive Tack Time
  • Halogen and Halide Free
  • Speed 25 to 150 mm/sec.
  • Clear Residue

› WS888 WATER SOLUBLE LEAD FREE SOLDER PASTE

LEAD TIME : Syringe/Jar 5 days | Price : $30.00
The WS888, manufactured by FCT Solder, displays previously unseen levels of repeatability and consistency even in a wide range of temperatures (65-85F) and relative humidity (25% - 65% RH). Commonly used in printed circuit board assembly.
  • Alloys SAC305 & SN100C
  • Stencil life > 8 hours
  • Acceptable Activity
  • Cleans Easily
  • Speed 25 to 150 mm/sec.
  • Low Voiding

Kester

› R276 NO-CLEAN SOLDER PASTE

LEAD TIME : 35 gr Syringe in Stock | Price : $20.00
Kester R276 is a no-clean solder paste designed for optimal characteristics in all types of dispensing applications. R276 is packaged void-free to insure consistent dispensing in high speed automated processes.
  • Alloys SAC305 & Sn63/Pb37
  • Stencil life > 8 hours
  • Extensive Tack Time
  • Leaded or Lead-Free
  • Dispense Speed: 4 dots per sec.
  • Clear Residue

› HM531 WATER-SOLUBLE SOLDER PASTE

LEAD TIME : 600 Gram Cart. In Stock | Price : $84.00
Kester HydroMark 531 is an organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance. Batch after batch, HM531 provides hours of stable stencil life, tack time, repeatable brick definition and is ideal for printed circuit board assembly.
  • Alloys: Sn63Pb37 or Sn62Pb36Ag02
  • Stencil Life >8+ hours
  • Capable to a maximum speed of 150 mm/sec
  • Stable tack life
  • Lead free
  • Residue removes easily
*New Item

› EM907 LEAD-FREE SOLDER PASTE

LEAD TIME : 600 Gram Cart. In Stock | Price : $85.00
EnviroMarkTM 907 is a lead-free, air and nitrogen re-flowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys. This solder paste also exceeds the reliability standards and is ideal for printed circuit board assembly.
  • Alloys Sn96.5Ag3.0Cu0.5
  • Stencil Life >12+ hours
  • High print speeds up to 150 mm/s
  • Stable tack life
  • Lead free
  • Residue removes easily
*New Item

Amtech

› SYNTECH-N NO CLEAN SOLDER PASTE

LEAD TIME : 250 Gram Jar In Stock | Price : $60.00
Manufactured by Amtech, the SynTECH-N solder paste was designed for stencil printing. SynTECH will give you long stencil life, wide reflow window, good wetting compatibility and clear residue. Designed for the stencil printing process, one of the most important parts in the printed circuit board assembly process.

  • Low voiding
  • Synthetic materials
  • Stencil life > 10 hours
  • Wide reflow window
  • Excellent wettabilitty compatibility
  • Compatible with enclosed printing heads

› NC-560-LF LEAD-FREE NO-CLEAN SOLDER PASTE (250GR JAR)

LEAD TIME : 250 Gram Jar In Stock | Price : $65.00

NC-560-LF is a lead-free, no-clean, halide-free solder paste that delivers improved solderability with all Pb-Free metallization, including ENIG (Gold), OSP, HASL and immersion silver printed circuit boards. This solder paste is also low beading, low voiding, and anti-tombstoning to reduce scrap and rework.

  • Exceptional print definition
  • Long stencil life > 8 hours
  • Excellent wetting compatibility
  • Wide process window
  • Low voiding
  • Clear residue

› 4300 LEAD AND LEAD-FREE WATER WASHABLE SOLDER PASTE (250GR JAR)

LEAD TIME : 250 Gram Jar In Stock | Price : $65.00

The 4300 series offers true multi-process capabilities, ideal for water washable applications, able to be cleaned using standard aqueous cleaning systems without saponification. Utilizes synthetic materials that deliver ideal printing characteristics, unparalleled lot-to-lot consistency and extremely long stencil life. LF-4300 is also VOC and halide-free, and classified as RELO.

  • Synthetic materials
  • Can reflow high temperature alloys up to 300C
  • Complieswith RoHS directive 2002/95/EC
  • Wide reflow window
  • Excellent wettabilitty compatibility
  • Low voiding and mid-chip beading

Qualitek

› 798LF WATER SOLUBLE LEAD FREE SOLDER PASTE (250 GRAM JAR)

LEAD TIME : Temporarily Out Stock | Price : $60.00
The 798LF paste manufactured by Qualitek exhibits superior joint strength, excellent wettability, extraordinary print definition, tack life and will provide excellent cost savings. Qualitek has developed a unique flux system designed specifically for high temperature lead free alloys. Qualitek alloys are designed as a lead-free alterative for Sn/Pb alloys for Printed Circuit Board assembly operations.

  • Alloy Sn63/Pb37 MP=183C
  • Stencil life > 6 hours
  • Extraordinary tack life
  • Lead Free
  • Speed 25-50mm per second
  • Residue removes easily

› 875LF NO CLEAN LEAD FREE SOLDER PASTE (250 GRAM JAR)

LEAD TIME : Temporarily Out Stock | Price : $68.50
Manufactured by Qualitek this solder paste uses a unique flux system designed specifically for high temperature lead free alloys. Qualitek alloys are designed as a lead-free alternative for Sn/Pb alloys used in Printed Circuit Board assembly operations.

  • Sn63/Pb37 MP=217-221C
  • Stencil life > 8 hours
  • Extraordinary tack time
  • Halogen and lead free
  • Speed 25-50mm per second
  • No clean formula

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