717D is a Halogen free, water-soluble solder paste designed for surface mount and other electronic assembly (Printed Circuit Board assembly) applications using a syringe dispensing method.Excellent dot-to-dot consistency, Eliminates the use of solvents and Residues are easily removed with warm water.

The melting temperature of the solder and the heat resistance of components determine reflow Profile. 717D can be processed in most reflow media, (i.e. IR, Vapor-phase, Forced convection,etc). Ramp rate of 2.5-3.0°C per second is desirable, since most components are rated for 4.0°C per second.
The solder paste type 717D is water soluble formulation therefore the residues need to be removed. Residue removal is easily achieved,with the use of hot 60 °C (140 °F) de-ionized water in either a batch or conveyorized cleaner. Spray pressures should be maintained at 20-30 psi and conveyor speed of 3-6ft/min.

DESCRIPTION 619D is a No-clean solder paste designed for surface mount applicationssuch as Printed Circuit Board Assembly using a syringe dispensing method.
Post soldering residues are soft and pin-probable.

BENEFITS

• Bellcore compliant
• Excellent dot-to-dot consistency
• Non corrosive
• Pin Testable post solder residue
• Excellent wettability
• No cleaning required

Solder Composition. The water-soluble solder paste; DSP718D Sn/Ag/Cu (Tin/Silver/Cu) Alloys are designed as a lead-free alternative for Sn/Pb alloys for electronics assembly (Printed Circuit Board assembly)operations.

718D a unique flux system designed specifically for high temperature lead free alloys. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required, 718D Lead Free Solder paste will provide excellent cost savings.

Solder Composition for DPS 618D no clean solder paste: Sn/Ag/Cu (Tin/Silver/Cu). Alloys are designed as a lead-free alternative for Sn/Pb alloys for electronics assembly operations such as Printed circuit board assembly. The Qualitek Sn/Ag/Cu alloys conform and exceed the impurity requirements of J-Std-006 and all other relevant international standards.

Paste Application. Solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the paste enough time to come to thermal equilibrium with the environment. The flow rate of paste in a dispensing application depends on viscosity, which cn be altered by temperature change. If solder paste is supplied in syringes pre-mixing is not necessary due to the shear action produced from the dispensing.

The XP799 is a water soluble solder paste designed for surface mount and other electronic assembly (Printed Circuit Board assembly) applications. The unique properties of this formula provide excellent activity, long stencil life, long tack time, high print speed capability and a longer shelf life.

XP799 provides excellent print definition characterized by brick-like prints. Good release is seen on 12-9 mil apertures. Tests have proven that XP799 will perform during continuous printing for up to 8 hrs. Field test have shown that an abandon time of at least 1 hr is possible, resulting in a perfect 1st pass print on resumption of printing. Best results have been acheived when XP799 is reflowed in a forced air convection oven with a minimum of 8 zones (top&bottom), however reflow is possible with a 4 zone oven (top & bottom).

XP799 is water soluble formulation therefore the residues need to be removed. Residue removal is easily achieved,with the use of hot 60 °C (140 °F) de-ionized water in either a batch or conveyorized cleaner. Spray pressures should be maintained at 20-30 psi and conveyor speed of 3-6ft/min.

The XP692 is a new generation no clean solder paste for surface mount and other electronic assembly applications (e.g. Printed Circuit Board Assembly). XP692 provides features such as fine pitch capability (<16 mil), high-speed printing, and probable residues. In addition, XP692 paste exhibits excellent wettability, extraordinary print definition and tack life. The post soldering residues of XP692 are non-conductive, non-corrosive and highly insulated.

XP692 provides excellent print definition characterized by brick-like prints. Good release is seen on 12-9 mil apertures. Tack values are high even after extended open time in both normal and high humidity environments. Tests have proven that XP692 will perform during continuous printing for up to 10 hrs. Field test have shown that an abandon time of at least 1 hr is possible, resulting in a perfect 1st pass print on resumption of printing.

Best results have been acheived when XP692 is reflowed in a forced air convection oven with a minimum of 8 zones (top&bottom), however reflow is possible with a 4 zone oven (top & bottom). XP692 is a no clean formulation therefore the residues do not need to be removed for typical applications.

Qualitek has developed a unique flux system designed specifically for high temperature lead free alloys. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required, DSP 798LF Lead Free Solder paste will provide excellent cost savings. In addition, DSP 798LF Lead Free paste exhibits superior joint strength, excellent wettability, extraordinary print definition and tack life.

Qualitek Sn/Ag/Cu (Tin/Silver/Cu) Alloys are designed as a lead-free alternative for Sn/Pb alloys for electronics assembly (Printed Circuit Board assembly) operations. The Qualitek Sn/Ag/Cu alloys conform and exceed the impurity requirements of J-Std-006 and all other relevant international standards.

DSP798LF provides excellent print definition characterized by brick-like prints. Good release is seen on 12-9 mil apertures. Tack values are high even after extended open time in both normal and high humidity environments. Best results have been acheived when DSP 798LF is reflowed in a forced air convection oven with a minimum of 8 zones (top&bottom), however reflow is possible with a 4 zone oven (top & bottom).

DSP798LF is water soluble formulation therefore the residues need to be removed. Residue removal is easily achieved, with the use of hot 60 C (140 F) de-ionized water in either a batch or conveyorized cleaner. Spray pressures so be maintained at 20-30 psi and conveyor speed of 3-6ft/min.

Qualitek has developed a unique flux system designed specifically for high temperature lead free alloys. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required, DSP 875LF Lead Free Solder paste will provide excellent cost savings.

In addition, DSP 875LF Lead Free paste exhibits super low spattering, superior joint strength, excellent wettability, extraordinary print definition and tack life. The post soldering residues of DSP 875LF are non-conductive, non-corrosive and highly insulated.

Qualitek Sn/Ag/Cu (Tin/Silver/Cu) Alloys are designed as a lead-free alternative for Sn/Pb alloys for electronics assembly (PCB assembly) operations. The Qualitek Sn/Ag/Cu alloys conform and exceed the impurity requirements of J-Std-006 and all other relevant international standards.

DSP 875LF provides excellent print definition characterized by brick-like prints. Good release is seen on 12-9 mil apertures with prints speeds in the range of 1.0-6.0 inch per second (25mm-150mm). Best results have been acheived when DSP 875LF is reflowed in a forced air convection oven with a minimum of 8 zones (top&bottom), however reflow is possible with a 4 zone oven (top & bottom).

DSP 875LF is a no clean formulation therefore the residues do not need to be removed for typical applications. If residue removal is desired, the use of Everkleen 1005 Buffered Saponifier with a 5-15% concentration in hot 60 °C (140 °F) will aid in residue removal.