••• SOLDER PASTE

Solder paste is available for immediate delivery in 250 gram jars and 30 gram syringes:

  • Leaded No Clean & Water Soluble Solder Paste
  • Lead Free No Clean & Water Soluble Paste

To help us meet your specific needs, please provide us with information on your alloy, flux type, powder size and packaging preferences.

AIM Solder


FCT Solder

› NC676 NO CLEAN SOLDER PASTE

LEAD TIME : Syringe/Jar 5 days | Price : $20.00
The NC676, manufactured by FCT Solder, is a new generation halide-free, rosin-based chemistry designed to provide a previously unseen level of repeatability and consistency to the printing process. Ideal for leaded printed circuit board assembly.
  • Alloy Sn63/Pb37 MP=183°C
  • Stencil life > 8 hours
  • Extensive Tack Time
  • Halogen and Halide Free
  • Speed 25 to 150 mm/sec.
  • Clear Residue

› WS159 WATER SOLUBLE SOLDER PASTE

LEAD TIME : Syringe/Jar 5 days | Price : $20.00
The WS159, manufactured by FCT Solder, is designed to provide humidity tolerance and excellent wetting to meet the requirements for reliable solder joints in printed circuit board assemblies.
  • Alloy Sn63/Pb37
  • Stencil life > 6 hours
  • Good Activity
  • Cleans Easily
  • Speed: 25 to 150 mm/sec.
  • Shiny Solder Joints

› NL932 NO CLEAN LEAD FREE SOLDER PASTE

LEAD TIME : Syringe/Jar 5 days | Price : $30.00
The NL932, manufactured by FCT Solder, delivers Surface Area Ratio (SAR) paste transfer efficiencies below 0.6 and 0.55 respectively. NL932 is formulated to deliver exceptional cosmetics, especially when used in conjunction with Nihon Superior’s SN100C patented lead free alloy. It was specially designed to meet the requirements for reliable solder joints in printed circuit board assemblies.
  • Alloys SAC305 & SN100C
  • Stencil life > 8 hours
  • Extensive Tack Time
  • Halogen and Halide Free
  • Speed 25 to 150 mm/sec.
  • Clear Residue

› WS888 WATER SOLUBLE LEAD FREE SOLDER PASTE

LEAD TIME : Syringe/Jar 5 days | Price : $30.00
The WS888, manufactured by FCT Solder, displays previously unseen levels of repeatability and consistency even in a wide range of temperatures (65°-85°F) and relative humidity (25% - 65% RH). Commonly used in printed circuit board assembly.
  • Alloys SAC305 & SN100C
  • Stencil life > 8 hours
  • Acceptable Activity
  • Cleans Easily
  • Speed 25 to 150 mm/sec.
  • Low Voiding

Kester


Amtech

› SYNTECH-N NO CLEAN SOLDER PASTE

LEAD TIME : 250 Gram Jar In Stock | Price : $60.00
Manufactured by Amtech, the SynTECH-N solder paste was designed for stencil printing. SynTECH will give you long stencil life, wide reflow window, good wetting compatibility and clear residue. Designed for the stencil printing process, one of the most important parts in the printed circuit board assembly process.

  • Low voiding
  • Synthetic materials
  • Stencil life > 10 hours
  • Wide reflow window
  • Excellent wettabilitty compatibility
  • Compatible with enclosed printing heads

› NC-560-LF LEAD-FREE NO-CLEAN SOLDER PASTE (250GR JAR)

LEAD TIME : 250 Gram Jar In Stock | Price : $65.00

NC-560-LF is a lead-free, no-clean, halide-free solder paste that delivers improved solderability with all Pb-Free metallization, including ENIG (Gold), OSP, HASL and immersion silver printed circuit boards. This solder paste is also low beading, low voiding, and anti-tombstoning to reduce scrap and rework.

  • Exceptional print definition
  • Long stencil life > 8 hours
  • Excellent wetting compatibility
  • Wide process window
  • Low voiding
  • Clear residue

› 4300 LEAD OR LEAD-FREE WATER WASHABLE SOLDER PASTE (250GR JAR)

LEAD TIME : 250 Gram Jar In Stock | Price : $65.00

The 4300 series offers true multi-process capabilities, ideal for water washable applications, able to be cleaned using standard aqueous cleaning systems without saponification. Utilizes synthetic materials that deliver ideal printing characteristics, unparalleled lot-to-lot consistency and extremely long stencil life. LF-4300 is also VOC and halide-free, and classified as RELO.

  • Synthetic materials
  • Can reflow high temperature alloys up to 300°C
  • Complieswith RoHS directive 2002/95/EC
  • Wide reflow window
  • Excellent wettabilitty compatibility
  • Low voiding and mid-chip beading

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