SMT Reflow Ovens & Hot Plates |
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Product Information |
Lead Time |
Price |
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Gold-Flow™ GF-SL Single Hot Plate
The Gold-Flow™ GF-SL Single Hot Plate is used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies.
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4-6 weeks |
$1,200.00 |
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Gold-Flow GF-DL Dual Hot Plate
The Gold-Flow™ GF-DL Dual Hot Plate is used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies. The Dual Hot Plate model GF-DL is similar to the GF-SL, but with two independent temperature controls and dual 13˜ x 6.4˜ plates.
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4-6 weeks |
$1,700.00 |
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F2 Desktop SMT Reflow OvenThe F2 Desktop SMT batch reflow oven is highly suitable for small and mid-sized assembly projects. Proven in university and scientific environments, it has the capacity to reflow QFP, BGA, and CSP platforms with 0402 components. It reflows single or double sided boards.
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2-4 weeks |
$1,910.00 |
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F3 Desktop SMT Reflow OvenThe F3 Desktop reflow oven gives you ample working area to work on boards up to 13.77 inches by 11.02 inches for low volume batch assembly. Especially popular in university and scientific environments, it reflows QFP, BGA, and CSP platforms with 0402 components. Single or double sided boards ready.
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2-4 weeks |
$2,206.00 |
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F2c Desktop SMT Reflow OvenThe F2c Desktop reflow oven has an added feature for temperature management using a computer interface. Proven in university and scientific environments, it has the capacity to reflow QFP, BGA, and CSP platforms with 0402 components. It reflows single or double sided boards and is suitable for low volume batch assembly.
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2-4 weeks |
$2,352.00 |
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F3c Desktop SMT Reflow OvenThe F3c Desktop reflow oven has an added feature for temperature management using a computer interface and gives you ample working area to work on boards up to 13.77 inches by 11.02 inches. It reflows QFP, BGA, and CSP platforms with 0402 components. Single or double sided boards ready.
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2-4 weeks |
$2,648.00 |
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R200A Benchtop SMT Reflow OvenThe R200A SMT batch reflow oven is perfect for entry level prototype assembly. With a maximum PCB reflow area of 360mm*230mm (14"x9") this oven can handle most of your SMT assembly needs. Available in 110v or 220v the R200A is ready for lead free solder reflowing with a short 2 minute warm up. Featuring up to 40 programmable temperature setpoints a reflow profile curve of 3 min +/- 1 min can be set and saved without external software or interfaces. The saved profile can then be recalled for use at a later time. This is truly a standalone reflow toaster oven.
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2-4 weeks |
$2,800.00 |
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HA06 SMT Reflow Oven
Hot air / quartz oven
Outstanding reflow soldering quality for SMD and hybrid
Cures SMD adhesive
Two heating zones
Microprocessor controlled
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2-4 weeks |
$3,138.00 |
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R200C Benchtop SMT Reflow Oven
The R200C SMT batch reflow oven is perfect for entry level lead free prototype assembly.
With a maximum PCB reflow area of 360mm*230mm (14"x9") this oven can handle most of your SMT assembly needs.
Available in 110v or 220v the R200C is ready for lead free solder reflowing with a short 3 minute warm up.
Featuring up to 40 programmable temperature setpoints a reflow profile curve of 3 min +/- 1 min can be set and saved to the customer supplied PC.
The saved profile can then be recalled for use at a later time.
This reflow toaster oven couples the flexibility of a small desktop footprint with the ability to precisely control the reflow profile curve
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2-4 weeks |
$3,676.00 |
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Gold-Flow GF-C2 Dual Function Batch Oven or Hot Plate
The Gold-Flow™ GF-C2 Dual Function Batch Oven or Hot Plate is ideal for batch SMT reflow, curing and hot plate applications. With its heavy duty construction and stainless steel chamber, the oven is designed for many years of reliable service.
The GF-C conduction/convection oven has a unique dual function as a hot plate or as a forced air convection oven.
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4-6 weeks |
$3,850.00 |
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HA08 SMT Refow Quartz oven
Hot air / quartz oven
Outstanding reflow soldering quality for SMD and hybrid
Cures SMD adhesive
Two heating zones
Microprocessor controlled
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2-4 weeks |
$4,002.00 |
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R200N Benchtop SMT Reflow Oven
The R200N SMT batch reflow oven with nitrogen inlet is perfect for your challenging lead free prototype assembly projects.
With a maximum PCB reflow area of 360mm*230mm (14"x9") this oven can handle most of your SMT assembly needs.
Available in 110v or 220v the R200N is ready for lead free solder reflowing with a short 3 minute warm up.
Featuring up to 40 programmable temperature setpoints a reflow profile curve of 3 min +/- 1 min can be set and saved to the customer supplied PC.
The saved profile can then be recalled for use at a later time.
This reflow toaster oven couples the flexibility of a small desktop footprint with the ability to precisely control the reflow profile curve.
With the addition of nitrogen purge capability for the reflow environment this batch reflow oven is head and shoulders above the competition.
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2-4 Weeks |
$4,120.00 |
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T300 Full hot air Reflow OvenThe T300 has many specialties such as high precision, multi-function, practicality, steady capability, long life, energy-saving with high efficiency, viewable operation. It adapts to the research and production in research centers, war industry, middle- and small-sized corporations, small private corporations and other electronic production companies.
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2 weeks |
$4,764.71 |
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Gold-Flow™ GF-B Shuttle Batch Oven
The Gold-Flow™ GF-B Shuttle Batch Oven has a unique shuttle system that enables a higher throughput than standard batch SMT reflow ovens. Both sides of the oven have a cooling station, and while one board is being processed, another board can be cooled and off loaded, then a third board can be loaded and shuttled into the chamber for reflow.
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4-6 weeks |
$5,500.00 |
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T3A Full hot air Reflow Oven
- High reliability, Heating component which is made in high temperature conditions.
- High agility, five temperature-zones. It meets the requirement of SMT welding. It can be used as a solidified stove at the same time.
- Reasonable price, long life.
- Small volume. Saves electricity. It meets the requirements of small-type and multimode products in manufacturering. It is also suitable for laboratory to research.
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2 weeks |
$5,823.54 |
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ProtoFlow SMT Reflow Oven
The ProtoFlow is a premiere convection SMT reflow oven, ideal for lead-free reflow soldering, meeting the stringent demands of rapid PCB soldering applications. The ProtoFlow features even heat distribution, easy programming, and many pre-definied temperature profiles. The compact design and efficient power consumption make it one of the most useful components in any rapid PCB prototyping environment.
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1 week |
$6,400.00 |
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Mistral-260 SMT Refow oven
With touch screen control display, makes the use of an additional CPU unnecessary!! USB printer or storage device can directly be connected to the control.
The Mistral 260 convection reflow soldering systems uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems.
Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile.
By eliminating set-up time your production line can work to its fullest capacity.
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$9,478.00 |
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Gold-Flow GF-12HT Conveyorized SMT Reflow Oven
The GF-12HT SMT Reflow Oven uses a patented Horizontal Convection™ technology that circulates heated air in each chamber around the board front to back which increases the thermal efficiency and uniformity within each zone. This exposes the circuit board to a uniform temperature profile along the entire assembly. Cyclonic generator speed is independently set in each zone.
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4-6 weeks |
$10,000.00 |
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BM-W430 Lead-free Bench Top Reflow OvenTouch Screen, PLC control, 4 upper hot air convection, 4 bottom hot air convection, PCB size 11.81", Pin Chian and Mesh belt conveyor, stand with cabinet plus it can save 30 groups parameters.
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3 - 5 weeks |
$10,500.00 |
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Gold-Flow GF-120HC Conveyorized SMT Reflow Oven
These SMT reflow ovens are designed for higher production assembly than the smaller GF-12 series. The new Horizontal Convection? technology is ideal for lead-free soldering parameters.
With the patented Horizontal Convection?, air is circulated horizontally in one direction above the board, and in theopposite direction below the board. This circular air current, or ?cyclone? around the board, produces extremely uniform temperature profiles across the board. The model GF-120HT are high temperature ovens which are compatible with all lead free soldering applications.
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4-6 weeks |
$12,750.00 |
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BM-W630 Lead-free Bench Top Reflow OvenTouch Screen, PLC control, 6 upper hot air convection, 6 bottom hot air convection, PCB size 11.81", Pin Chian and Mesh belt conveyor, stand with cabinet plus it can save 30 groups parameters.
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3 - 5 weeks |
$12,750.00 |
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Mistral-360 SMT Convection refow oven
With touch screen control display, makes the use of an additional CPU unnecessary!! USB printer or storage device can directly be connected to the control.
The Mistral 360 convection reflow soldering system uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems.
Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile.
By eliminating set-up time your production line can work to its fullest capacity.
Convection heating provides other advantages over IR. In addition tot the wide process window, it works with:
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$15,990.00 |
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4 - 6 weeks |
$16,298.00 |
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4 - 6 weeks |
$16,298.00 |
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BM-W645 G2 Lead-free Mid-sized Reflow Oven6 upper forced air convection zones, 6 bottom forced air convection zones, pin chain&mesh belt conveyor, Max PCB size 15.74", In-built industrial chiller for cooling with one cooling zone, PC control plus PLC control.
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4 - 6 weeks |
$21,000.00 |
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BM-W845 G2 Lead-free Mid-sized Reflow Oven8 upper forced air convection zones, 8 bottom forced air convection zones, pin chain&mesh belt conveyor, Max PCB size 15.74", In-built industrial chiller for cooling with one cooling zone, PC control plus PLC control.
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4 - 6 weeks |
$23,700.00 |
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Mistral 460 SMT Reflow Oven
With touch screen control display, makes the use of an additional CPU unnecessary!! USB printer or storage device can directly be connected to the control.
The Mistral 460 convection reflow soldering system uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems.
Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile.
By eliminating set-up time your production line can work to its fullest capacity.
Convection heating provides other advantages over IR. In addition tot the wide process window, it works with:
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$24,600.00 |
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SF-8C Lead-free Reflow Oven8 upper forced air convection zones, 7 bottom forced air convection zones, pin chain & mesh belt conveyor, Max PCB size 19.68", industrial chiller for cooling and PC control.
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4 - 6 weeks |
$30,000.00 |
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SF-10C Lead-free Reflow Oven10 upper forced air convection zones, 10 bottom forced air convection zones, pin chain & mesh belt conveyor, Max PCB size 19.68", industrial chiller for cooling and PC control.
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4 - 6 weeks |
$31,950.00 |
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RO-500 - SMT OvenThe Solano convection oven is DIMA’s answer to demanding LEAD FREE production processes. Special designed process chambers transfer the heat with a minimum of stress for the components. Even with lead free applications temperatures stay below the critical component temperatures.
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4 - 6 weeks |
$32,897.00 |
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RO-510 - SMT OvenThe Solano convection oven is DIMA’s answer to demanding LEAD FREE production processes. Special designed process chambers transfer the heat with a minimum of stress for the components. Even with lead free applications temperatures stay below the critical component temperatures. This model is equipped with an additional edge conveyor.
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4 - 6 weeks |
$36,393.00 |
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