••• REFLOW OVENS

A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards. The oven usually contains multiple zones, which can be individually controlled for temperature. We offer benchtop batch solder reflow oven to automatic floor style systems.

› GF-125 HC NEW AUTOMATIC SOLDER REFLOW OVEN

LEAD TIME : 4 weeks | Price : $17,995.00

The GF 125 HC Convection reflow oven for PCBs with 5 zones on top and five bottom vertical heating zones, the NEW GF-125 HC/HT is an economic solution for automatic medium volume production runs. Utilizing horizontal convection heating technology, the GF-125 HC/HT provides uniform temperature profiling across the entire PCB board for enhanced SMT process control. With temperatures up to 400°C, the GF-125 horizontal convection reflow oven is capable of lead-free soldering.

The GF-12/120/125 series heating profiles are superior to other ovens in their class. Each of the vertical heating zones is programmable through the controller which stores up to 100 profiles. The oven includes a real-time temperature profiler port. When a thermocouple is attached to the PC board, the actual board level temperature profile is displayed graphically as the board travels through the oven. The conveyor speed, heating elements, cyclonic generators and cooling fans are all programmable so the unit is ideal for high-mix pcb manufacturing runs. The oven also features SPC fault monitoring & reporting, battery backup and a 7 day timer for automatic machine start-up.

› M6 LEAD FREE REFLOW OVEN

LEAD TIME : 4 weeks | Price : $21,850.00 $19,665.00
This convection reflow oven is ideal for mid-to-high volume lead-free soldering production lines.
  • 6 upper and 6 bottom forced hot air convection zones allow high quality lead-free soldering with uniform heating and exceptional process stability
  • Temperature accuracy of ±1°C and a high-speed CE certificated blower for maximum convection
  • Individual temperature control for all zones

› M8 LEAD FREE REFLOW OVEN

LEAD TIME : 4 weeks | Price : $24,750.00 $23,512.00
This convection reflow oven is ideal for mid-to-high volume lead-free soldering production lines.
  • 8 upper and 8 bottom forced hot air convection zones allow high quality lead-free soldering with uniform heating and exceptional process stability
  • Temperature accuracy of ±1°C and a high-speed CE certificated blower for maximum convection
  • Individual temperature control for all zones

› M10 LEAD-FREE REFLOW OVEN

LEAD TIME : 4 weeks | Price : $33,950.00
M10 Lead free Reflow oven is specially designed for mid-high volume production.
  • 10 upper and 10 bottom forced hot air convection zones allow high quality lead-free soldering with uniform heating and exceptional process stability
  • Temperature accuracy of ±1°C, ensure the best temperature control across the Printed Circuit Board Assembly
  • Mass production requirement in the range of 900-1400pcs/8hours (Take 300x300 PCB as reference)

› E4 LEAD-FREE REFLOW OVEN

LEAD TIME : 4 weeks | Price : $12,560.00
This convection reflow oven is ideal for low-volume lead-free soldering production lines.
  • 4 upper and 4 bottom forced hot air convection zones allow high quality lead-free soldering with uniform heating and exceptional process stability
  • Temperature accuracy of ±1°C and a high-speed CE certificated blower for maximum convection
  • Individual temperature control for all zones

› E6 LEAD-FREE REFLOW OVEN

LEAD TIME : 4 weeks | Price : $16,800.00 $15,960.00
This convection reflow oven is ideal for low-volume lead-free printed circuit board soldering production lines.
  • 6 upper and 6 bottom forced hot air convection zones allow high quality lead-free soldering with uniform heating and exceptional process stability
  • Temperature accuracy of ±1°C and a high-speed CE certificated blower for maximum convection
  • Individual temperature control for all zones

› ERO-500 CONVEYOR REFLOW OVEN

LEAD TIME : 4 weeks | Price : $16,950.00

Reflow oven with five (5) top and five (5) bottom vertical heating zones, the ERO-500 is an economic solution for low to medium volume production runs. Utilizing plenum convection heating technology, the ERO-500 provides uniform temperature profiling across the entire PCB board for enhanced SMT process control. With a maximum high soldering temperature of 320°C, the ERO-500 is compatible with most lead and lead-free solder paste profiles.

› 1800HT CONVEYOR REFLOW OVEN

LEAD TIME : 4 weeks | Price : $22,995.00

Reflow oven with four (4) heating zones and 18" (457mm) wide conveyor for low to medium volume soldering production runs. The 1800HT solder reflow oven utilizes our patented Horizontal Convection® heating technology for extremely uniform temperature profiling across the board for enhanced reflow surface-mount process control. Units available with a maximum temperature of 400°C (752°F) and can be used for lead or lead-free solder applications.

› 2000HT CONVEYOR REFLOW OVEN

LEAD TIME : 4 weeks | Price : $26,995.00
Higher throughput SMT reflow oven with 20" (508mm) wide conveyor for production runs. The 2000HT hot-air reflow system utilizes our patented Horizontal Convection Heating technology with digital temperature controls for extremely uniform air circulation and temperature profiling across the board – providing enhanced process control. The soldering does not exceed limits acroos the board so every SMD is protected. The unit is available with maximum heating temperature of 250°C (482°F) for lead solder or hotter 400°C (752°F) for lead-free solder operation.

› GF-SL-HT SINGLE HOT PLATE

LEAD TIME : 4 weeks | Price : $1,450.00 $1,377.00
GF-SL-HT Hot Plates Lead-free and lead soldering, single function hot plate with programmable digital temperature control and 13" x 13" (330mm x330mm) heating area.

› GF-DL-HT DUAL HOT PLATE

LEAD TIME : 4 weeks | Price : $2,195.00 $2,085.25
GF-DL-HT Dual Hot Plate is used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies.The GF-DL-HT is capable of lead and lead free, high temperature applications and has dual programmable, two digital temperature controllers for precise temperature regulation.

› GF-B-HT SHUTTLE BATCH OVENS

LEAD TIME : 4 weeks | Price : $4,950.00 $4,702.00
The Gold-Flow™ GF-B-HT Shuttle Batch oven was designed for prototyping printed circuit board assembly and batch production runs. Capable for lead or lead-free soldering. While one PCB is being processed, another circuit board can be cooled and off-loaded, then a third board can be loaded and shuttled into the chamber for reflow

› PROTOFLOW S SMT REFLOW OVEN

LEAD TIME : 1 week | Price : $7,500.00
Convection SMT reflow ovens, ideal for lead-free reflow soldering, meeting the stringent demands of rapid printed circuit board soldering applications. The ProtoFlow S features even heat distribution, easy programming, and many pre-definied temperature profiles. The compact design and efficient power consumption make it one of the most useful components in any rapid printed circuit boards prototyping environment.

› GF-12HT CONVEYORIZED SMT REFLOW OVEN

LEAD TIME : 4 weeks | Price : $8,995.00 $8,545.00
The GF-12HT SMT Reflow Oven uses a patented Horizontal Convection™ technology that circulates heated air in each chamber around the printed circuit board front to back which increases the thermal efficiency and uniformity within each zone. This exposes the circuit boards to a uniform temperature profile along the entire SMT PCB assembly. Cyclonic generator speed is independently set in each zone.

› GF-120HT CONVEYORIZED SMT REFLOW OVEN

LEAD TIME : 4 weeks | Price : $13,500.00 $12,825.00
Three (3) heating zone reflow ovens for batch production runs utilizing our patented Horizontal ConvectionTM Heating technology for extremely uniform temperature profiling across the printed circuit board for enhanced process control. The GF-120HT is lead-free compatible for RoHS compliant soldering

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