The GF 125 HC Convection reflow oven for PCBs with 5 zones on top and five bottom vertical heating zones, the NEW GF-125 HC/HT is an economic solution for automatic medium volume production runs. Utilizing horizontal convection heating technology, the GF-125 HC/HT provides uniform temperature profiling across the entire PCB board for enhanced SMT process control. With temperatures up to 400°C, the GF-125 horizontal convection reflow oven is capable of lead-free soldering.
The GF-12/120/125 series heating profiles are superior to other ovens in their class. Each of the vertical heating zones is programmable through the controller which stores up to 100 profiles. The oven includes a real-time temperature profiler port. When a thermocouple is attached to the PC board, the actual board level temperature profile is displayed graphically as the board travels through the oven. The conveyor speed, heating elements, cyclonic generators and cooling fans are all programmable so the unit is ideal for high-mix pcb manufacturing runs. The oven also features SPC fault monitoring & reporting, battery backup and a 7 day timer for automatic machine start-up.
Reflow oven with five (5) top and five (5) bottom vertical heating zones, the ERO-500 is an economic solution for low to medium volume production runs. Utilizing plenum convection heating technology, the ERO-500 provides uniform temperature profiling across the entire PCB board for enhanced SMT process control. With a maximum high soldering temperature of 320°C, the ERO-500 is compatible with most lead and lead-free solder paste profiles.
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