••• SMT REFLOW OVENS & HOT PLATES

A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards. The oven usually contains multiple zones, which can be individually controlled for temperature. We offer benchtop batch solder reflow oven to automatic floor style systems.

› GF-SL-HT SINGLE HOT PLATE

LEAD TIME : 10 weeks | Price : $1,450.00
GF-SL-HT Hot Plates Lead-free and lead soldering, single function hot plate with programmable digital temperature control and 13" x 13" (330mm x330mm) heating area.

› GF-DL-HT DUAL HOT PLATE

LEAD TIME : 10 weeks | Price : $2,195.00
GF-DL-HT Dual Hot Plate is used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies.The GF-DL-HT is capable of lead and lead free, high temperature applications and has dual programmable, two digital temperature controllers for precise temperature regulation.

› T200 SERIES - BENCHTOP SMT REFLOW OVENS

LEAD TIME : 7 Days | Price : $3,145.00
The T200 Series Reflow Ovens are ideal for low volume prototype printed circuit board assembly. One of the favorites in labs, universities and schools. These ovens can handle most of your SMT prototype circuit board assembly needs.
  • With Software Interface. View, save and print hard copies of real-time thermal profiling data
  • Up to 40 sequential temperature setpoints help you reproduce solder paste profiling curves
  • Work with leaded and lead-free solders

› HA SERIES - SMT REFLOW OVENS

LEAD TIME : 2-4 weeks | Price : $4,266.00
HA Series SMT Reflow Ovens are benchtop ovens designed to work with single printed circuit boards, ideal for laboratory or prototype use. These ovens are made in Europe and are long lasting equipments with higher quality than the usual ovens.
  • Lead Free quartz infrared and hot-air convection
  • Nitrogen (N2) inlet option
  • Two heating zones

› GF-B-HT SHUTTLE BATCH OVENS

LEAD TIME : 10 weeks | Price : $4,950.00
The Gold-Flow™ GF-B-HT Shuttle Batch oven was designed for prototyping printed circuit board assembly and batch production runs. Capable for lead or lead-free soldering. While one PCB is being processed, another circuit board can be cooled and off-loaded, then a third board can be loaded and shuttled into the chamber for reflow

› PROTOFLOW S SMT REFLOW OVEN

LEAD TIME : 1 week | Price : $7,500.00
Convection SMT reflow ovens, ideal for lead-free reflow soldering, meeting the stringent demands of rapid printed circuit board soldering applications. The ProtoFlow S features even heat distribution, easy programming, and many pre-definied temperature profiles. The compact design and efficient power consumption make it one of the most useful components in any rapid printed circuit boards prototyping environment.

› GF-12HT CONVEYORIZED SMT REFLOW OVEN

LEAD TIME : 10 weeks | Price : $8,995.00
The GF-12HT SMT Reflow Oven uses a patented Horizontal Convection™ technology that circulates heated air in each chamber around the printed circuit board front to back which increases the thermal efficiency and uniformity within each zone. This exposes the circuit boards to a uniform temperature profile along the entire SMT PCB assembly. Cyclonic generator speed is independently set in each zone.

› GF-120HT CONVEYORIZED SMT REFLOW OVEN

LEAD TIME : 10 weeks | Price : $13,500.00
Three (3) heating zone reflow ovens for batch production runs utilizing our patented Horizontal ConvectionTM Heating technology for extremely uniform temperature profiling across the printed circuit board for enhanced process control. The GF-120HT is lead-free compatible for RoHS compliant soldering

› BM-W430 LEAD-FREE REFLOW OVEN

LEAD TIME : 3 - 5 weeks | Price : $10,560.00
This convection reflow oven is ideal for low-volume lead-free soldering production lines.
  • 4 upper and 4 bottom forced hot air convection zones allow high quality lead-free soldering with uniform heating and exceptional process stability
  • Temperature accuracy of ±1°C and a high-speed CE certificated blower for maximum convection
  • Individual temperature control for all zones

› MISTRAL 260 REFLOW SOLDERING OVEN

LEAD TIME : | Price : $10,865.00
The Mistral 260 convection reflow soldering ovens use re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. By eliminating the set-up time, your production line can work to its fullest capacity!
  • Three heat zones, each independently controlled for accurate temperature profiles
  • Touch screen control display, no need of additional CPU
  • USB printer or storage device can directly be connected to the control

› BM-W630 LEAD-FREE REFLOW OVEN

LEAD TIME : 3 - 5 weeks | Price : $12,990.00
This convection reflow oven is ideal for low-volume lead-free printed circuit board soldering production lines.
  • 6 upper and 6 bottom forced hot air convection zones allow high quality lead-free soldering with uniform heating and exceptional process stability
  • Temperature accuracy of ±1°C and a high-speed CE certificated blower for maximum convection
  • Individual temperature control for all zones

› MISTRAL-360 SMT CONVECTION REFLOW OVEN

LEAD TIME : | Price : $18,330.00
With touch screen control display, makes the use of an additional CPU unnecessary!! USB printer or storage device can directly be connected to the control.

The Mistral 360 convection reflow soldering system uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile. By eliminating set-up time your production line can work to its fullest capacity. Convection heating provides other advantages over IR. In addition tot the wide process window, it works with:

› RO-403 - BREEZE 400 MM WIDE CONVECTION OVEN WITH MESH BELT

LEAD TIME : 4 - 5weeks | Price : $18,964.00

RO-403 Full Convection Reflow Ovens offer full forced hot air heating

  • 8 independently controlled heating zones
  • Integrated cooling zone
  • Air ioniser for ESD safe reflow soldering

› RO-413 - BREEZE 375 MM WIDE CONVECTION OVEN WITH EDGE CONVEYOR

LEAD TIME : 4 - 6 weeks | Price : $18,964.00

RO-403 Full Convection Reflow Ovens offer full forced hot air heating

  • 8 independently controlled heating zones
  • Integrated cooling zone
  • Air ioniser for ESD safe reflow soldering

› MISTRAL-460 SMT REFLOW OVEN

LEAD TIME : 4 weeks | Price : $28,200.00
The Mistral 460 convection reflow soldering system uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. Full Convection Reflow Ovens offer full forced hot air heating to maintain consistent edge-to-edge temperatures, regardless of printed circuit board component size or density,an ideal profile, preheat temperatures are maintained long enough to permit activation of fluxes, while exposure of the components to higher reflow temperatures is kept to a minimum.
With touch screen control display, makes the use of an additional CPU unnecessary!! USB printer or storage device can be directly connected to the control.

› BM-W645 LEAD-FREE MID-SIZED REFLOW OVEN

LEAD TIME : 4 - 6 weeks | Price : $20,850.00
This convection reflow oven is ideal for mid-to-high volume lead-free soldering production lines.
  • 6 upper and 6 bottom forced hot air convection zones allow high quality lead-free soldering with uniform heating and exceptional process stability
  • Temperature accuracy of ±1°C and a high-speed CE certificated blower for maximum convection
  • Individual temperature control for all zones

› BM-W845 LEAD-FREE MID-SIZED REFLOW OVEN

LEAD TIME : 4 - 6 weeks | Price : $22,950.00
This convection reflow oven is ideal for mid-to-high volume lead-free soldering production lines.
  • 8 upper and 8 bottom forced hot air convection zones allow high quality lead-free soldering with uniform heating and exceptional process stability
  • Temperature accuracy of ±1°C and a high-speed CE certificated blower for maximum convection
  • Individual temperature control for all zones

› SF-8C LEAD-FREE REFLOW OVEN

LEAD TIME : 4 - 6 weeks | Price : $31,500.00
SF-8C Lead free Reflow oven is specially designed for mid-high volume production.
  • 8 upper and 8 bottom forced hot air convection zones allow high quality lead-free soldering with uniform heating and exceptional process stability
  • Temperature accuracy of ±1°C, ensure the best temperature control across the Printed Circuit Board Assembly
  • Mass production requirement in the range of 900-1400pcs/8hours (Take 300x300 PCB as reference)

› SF-10C LEAD-FREE REFLOW OVEN

LEAD TIME : 4 - 6 weeks | Price : $33,950.00
SF-10C Lead free Reflow oven is specially designed for mid-high volume production.
  • 10 upper and 10 bottom forced hot air convection zones allow high quality lead-free soldering with uniform heating and exceptional process stability
  • Temperature accuracy of ±1°C, ensure the best temperature control across the Printed Circuit Board Assembly
  • Mass production requirement in the range of 900-1400pcs/8hours (Take 300x300 PCB as reference)
30%

The Best Prototype PCB Prices: $15 ea 2L; $35 ea 4L; $70 ea 6L; $100 ea 8L
Off on SMT Stencil with your PCB order!