Flip-up stencils are small solder paste stencils typically used to print a single component a printed circuit board. They were designed to be used with the MSP 100/300/400 and SH-1 printers though they can be used manually. They come with a holder and a squeegee blade

Flip-up Stencils are custom made for any component and can be customized with relief areas, to eliminate removing neighboring components. They have the same footprint and aperture sizes used in a regular production stencil. They can be made in BGA, QFP, PLCC, SOIC, and connector patterns.

Key features:

Smooth Aperture Walls

Excellent Print Performance

Reduce rework assembly time

Improve quality of rework

Gerber data or mechanical drawings

Optimum stability

Do not contaminate surrounding areas

Front ramps to prevent solder paste spillage

Reinforced walls to prevent side to side shift