AQUA FLUX 150N is a pH neutral liquid flux formulated for producing defect free assemblies in wave soldering processes employing water cleaning. It provides excellent ionic cleanliness after water cleaning. 150N contains no free acid but possesses a high activity level. AQUA FLUX 150N is also suitable for surface mount assembly soldering operations.

APPLICATION:
AQUA FLUX 150N is a low smoking, neutral pH foam flux. Using moderate airflow rates, its fine-bubble foam head is fast breaking and recovers rapidly for effective coverage at high production speeds. This active flux will produce bright shiny solder connections. The residues wash off easily to very low levels of ionic contamination. Water washing can be done without the use of rinse aids with little or no foaming. Cleaning can be delayed because the flux has no free acids. The flux is formulated so that the cleaning process water effluent is completely biodegradable. Local regulations may require pretreatment to raise the pH to remove dissolved lead from water effluent.

FLUX CONTROL:
The specific gravity of the flux should be maintained between 0.85 and 0.87. The amount of flux to be applied during foaming applications should be between 800 and 1300 micrograms per square inch of solids. The amount of flux to be applied during spray application should be between 475 and 850 micrograms per square inch of solids.

SPRAY SYSTEMS:
AQUA FLUX 150N is suitable and enhanced by the use of a total loss spray system. Ideally an air knife should be fitted even when using a spray system in order to prevent insufficient capillary action when soldering. Spray system air knives should normally be angled slightly towards the system.

FOAMING SYSTEMS:
The air knife hole diameter should be between 1 and 1.5 mm and the distance from the fluxer to the air knife should be approximately 4 to 6 inches. The air knife should be angled between 5 to 12 degrees away from the foam wave so that excess flux can be removed without destroying the foam head.

CONVEYOR SPEED:
The ideal conveyor speed is dependent on the type of board and preheat requirements, but a speed between 3.5 to 6.5 feet will suit most applications.

PREHEAT:
A topside temperature between 80 and 110 degrees Celsius is recommended. A bottom side temperature should be 35 degrees Celsius higher than the topside.

SOLDER TEMPERATURE:
A solder temperature between 230 and 250 degrees Celsius should be maintained.

CLEANING:
All ingredients in AQUA FLUX 150N are completely soluble in plain water. Cleaning can be accomplished with in-line water cleaners, batch cleaners or manually. No soap or saponifiers are required to remove residues. It is recommended that the temperature of the water wash step be above 100°F to ensure efficient removal and low foaming. A final rinse with de-ionized water will ensure maximum cleanliness. Because the residues from AQUA FLUX 150N flux have a neutral pH, they can be cleaned as long as 8 hours after soldering and not cause corrosion of the assembly.

THINNING:
The consistency of AQUA FLUX 150N should be maintained by the addition of thinner to compensate for evaporation losses. It is recommended that the specific gravity @77F be maintained between 0.850 and 0.865 by addition of thinner. Only Flux Thinner FT-100 should be used for this purpose to ensure consistency of flux foaming and soldering characteristics.

SAFETY AND HANDLING
Keep away from heat, sparks and open flames. Use in well-ventilated area and observe standard precautions for handling and use. Refer to the Material Safety Data Sheet for further information.

Available in 1-gallon jugs, 5-gallon pails and 55 gallon drums. Refer to MSDS for additional information.