Stencils Unlimited has partnered with Nihon Superior to be able to offer their patented lead free nickel stabilized tin/copper wave solder alloy- SN100C in North America. SN100C was developed to offer a technically superior and more economical option to the tin-silver-copper alloys also being consid­ered. SN100C gives bridge-free wave soldering at temperatures normally used with tin/lead alloys.

With over 750 lines in commercial production, some for over 6 years, and more than 250 million boards in service, SN100C gives you the confidence that switching to lead free does not have to be difficult.

The patented addition of nickel to the tin-copper eutectic offers the following advantages:

Bridge-free wave soldering at 250°C- 260°C (482°F- 500°F) Does not require special solder pots No shorts on QFP to 0.65mm, 100 pins Easy to manage in the solder pot Smooth, bright fillets Lower cost than silver containing lead free alloys Good penetration of through holes Lower drossing than other lead free alloys No joint failure in more than five years of service Free Solder Pot Analysis Program Can be used in air

CHARACTERISTIC	SN100C	TIN/.7CU	TIN/4AG/.5CU	TIN/3AG/.5CU	TIN/0.3AG/.7CU/BI
Smooth, Shiny Joint?	YES	NO	NO	NO	NO
Reactivity To Equipment	LOW	HIGH	HIGH	HIGH	HIGH
Eutectic? (Paste Range)	YES	YES	YES	NO (4°C)	NO (10° to 11°C)
Contains Bismuth?	NO	NO	NO	NO	YES
Easy Pot Management?	YES	NO	NO	NO	NO
Low Cost?	YES	YES	NO	NO	YES
Low Drossing?	YES	NO	NO	NO	NO

Applications

PRODUCT NAME	APPLICATION	MELTING POINT (°C)
SN100C	Wave Soldering, Manual Rework, Dip Soldering, Re?ow Soldering	227
SN100Ce	SN100C Bath Maintenance	227-230
SN100CL	Hot Air Solder Level (HASL)	227
SN100CLe	SN100CL Bath Maintenance	227-230
SN100C3	High Temperature Tinning And Dip Soldering	227-310
SN100C4	High Temperature Tinning And Dip Soldering	227-340

SN100C lead free solder will perform equally well in automated wave soldering, reflow soldering (separate technical data available), selective soldering, and static solder pots. SN100C3 and SN100C4 have been specifically developed for high temperature dipping applications and can be used for tinning very ?ne copper wires at temperatures up to 400°C. SN100CL has been developed for use in lead free Hot Air Solder Level (HASL) equipment and provides a smooth bright finish with a solderable shelf life of over one year.

As the SN100C solder bath is used, copper tends to dissolve into the solder from the boards and component leads. If the copper content of the solder bath exceeds 0.85%, there is likely to be an increase in the incidence of bridges, icicles, and other defects. In order to maintain the proper copper level in the bath Stencils Unlimited offers the Nihon Superior SN100Ce as the top-up alloy. It has a lower copper content than the SN100C so that the copper content in the solder pot stays below the critical level of 0.85%. Verification of copper content is easy with the free Solder Pot Analysis Program offered by Stencils Unlimited. The program gives a statistical analysis of your SN100C solder pot with trend graphs so the copper level can be tracked over time.