The NC648 is not longer available. It has been replaced by the NC670

Product Description
The NC648 no-clean solder paste (Sn63 Pb37) is a modified rosin based paste, which allows a previously unseen level of repeatablity and consistency. This paste offers excellent open time, extended abandon time and good soldering activity and leaves a very clear, colorless post soldering residue.

Attributes

Clear, colorless Residue

ROL0 to ANSI/J-STD-004

Enhanced activity for tough to solder boards and components

Excellent slump resistance

High speed stencil printing up to 100mm/sec

Excellent tack performance and printer open time

Extended “between-print” abandon time

Performance
The performance of solder paste depends in part on the metal content, solder alloy and the solder particle size range. Increasing metal content reduces the tendency to slump and reduces the tack life of the solder paste, while the solder balling performance improves.

Refrigeration and storage: It is recommended to store NC648 at 5-10°C. The paste should be removed from cold storage a minimum of 8 hours in the unopened container prior to use. If the paste does not reach room temperature, it may stick to the stencil, not deposit onto the SMT pads, de-wet pads during reflow, outgas during reflow, or produce solder balls. Avoid direct sunlight.