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••• NC165 NO CLEAN FLUX

NC165 No Clean Flux

LEAD TIME: Temporarily Out of Stock    |     PRICE : $110.00
Data Sheet PDF

QUICK OVERVIEW
NC165 NO CLEAN FLUX is a halide-free, no clean activated material formulated to work with Printed Circuit Board Assembly’s SN100C Bar Solder and standard Sn/Pb Alloys. NC165 eliminates solder balls while providing excellent solderability with minimal flux residue.

  • A solder temperature of 250-260 degrees C should be maintained
  • Excellent Solderability
  • Available in 1 Gallon Container

Product Description
NC165 has slightly lower solids content than NC160 for applications where less flux residue is desired.

Material Safety Data Sheets (MSDS)
NC1165 No Clean Flux MSDS

Information:
  • The specific gravity of the flux should be maintained between 0.80 and 0.84.
  • The amount of flux to be applied during foaming applications should be between 800 and 1300 micrograms per square inch of solids.
  • The amount of flux to be applied during spray application should be between 475 and 850 micrograms per square inch of solids.

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