Mini-Micro Stencils |
| |
Product Information |
Lead Time |
Price |
|
|
Mini Mirror
The MM-1 Mini Mirror allows the user to inspect solder joints of a BGA component before and after the reflow at the BGA rework process. The operator will be able to visually inspect the outer row of solder joints to determine proper wetting, and alignment.
|
3-5 Days |
$49.00 |
 |
|
Flip-Up Stencils
Flip-up stencils are small solder paste stencils typically used to print a single component on a printed circuit board. They were designed to be used with the MSP 100/300/400 and SH-1 printers though they can be used manually. They come with a holder and a squeegee blade
|
3-5 Days |
$89.00 |
|
|
CPF Stencils
Component Print Frame (CPF) were designed to ensure accurate solder paste deposition onto the balls of the BGA. Because the CPF prints paste onto the BGA, there are no keep out or clearance issues with adjacent component on the PCB. They come with a squeegee blade
|
3-5 Days |
$135.00 |
|
