••• LIQUID SOLDER FLUX

Liquid Flux for wave soldering through-hole, mixed and surface mount assemblies is available for immediate delivery in 1-gallon container.

Additional products and custom formulations are also available upon request.

› NC160 LEAD FREE FLUX

LEAD TIME : 4 Days | Price : $25.00
NC160 NO CLEAN FLUX is a halide-free, no clean activated material for printed circuit board surface mounting. NC160 is formulated to work with Printed Circuit Board Assembly’s SN100C Bar Solder.

  • A solder temperature of 250-260 degrees C should be maintained
  • Excellent Solderability
  • Available 1 Gallon Container

› NC110 NO CLEAN FLUX

LEAD TIME : Temporarily Out Stock | Price : $50.00
NC110 Low Residue NO CLEAN FLUX is a halide-free, non rosin, organic 2% solids activated material for wave soldering through-hole, mixed and for printed circuit board assemblies.

  • A solder temperature of 230-250 degrees C is recommended
  • Excellent Solderability
  • Available in 1 Gallon Container

› NC120 NO CLEAN FLUX

LEAD TIME : Temporarily Out Stock | Price : $110.00
NC120 Low Residue NO CLEAN FLUX is a halide-free, non rosin, organic 2% solids activated material for wave soldering through-hole, mixed and for printed circuit board assemblies.

  • A solder temperature of 230-250 degrees C Recommended
  • Excellent Solderability
  • Available in 1 Gallon Container

› NC165 NO CLEAN FLUX

LEAD TIME : Temporarily Out Stock | Price : $110.00
NC165 NO CLEAN FLUX is a halide-free, no clean activated material formulated to work with Printed Circuit Board Assembly’s SN100C Bar Solder and standard Sn/Pb Alloys. NC165 eliminates solder balls while providing excellent solderability with minimal flux residue.

  • A solder temperature of 250-260 degrees C should be maintained
  • Excellent Solderability
  • Available in 1 Gallon Container

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