BGA Rework Stencils

StencilQuik BGA Rework Stencils were specially designed to make your rework faster and simpler. They use a breakthrough method that allows you to simplify the placement/replacement of area array devices such as BGAs and CSPs as well as other leaded SMT devices.

Component Stencils are laser cut stencils typically used to manually print a single component on a printed circuit board. They are bent on 2 sides, creating two side flaps for the purpose of holding the stencil between the thumb and finger. A squeegee blade is included. These solder paste stencils are custom-made for any component and can be customized with relief areas, to eliminate removing neighboring components.

The StencilQuik BGA Rework Kit includes all of the materials you need to place most BGAs that you will encounter. These rework tools packaged together along with your specified solder paste or tacky flux supplies you with the tools you need to place BGAs and other area array devices quickly and reliably.

This kit equips you with the necessary StencilQuik stencils to place 0.5mm, 0.8mm, 1.0mm, 1.27mm, and 1.5mm pitch area array devices. Full array StencilQuik patterns can be customized by either trimming the stencil for smaller package sizes or by masking off the center areas to create a perimeter array.